Lower cost applications and configurations now have a standards-based platform, which leverages existing technologies and advantages developed for AdvancedTCA® products, in a form factor that fits diverse packaging solutions and is largely compatible at the application level. By enabling hardware and software reuse, MicroTCA® solutions are easier to bring to market with the flexibility to scale as demands change.
Designed to the MicroTCA open standard, MicroTCA products are physically smaller and have finer-grained scalability than the AdvancedTCA communications servers. Emerson’s MicroTCA platforms will be used in a wide range of market segments and applications where reducing the capital cost of installing or extending next-generation network elements is very important.
The Centellis™ 500 is an innovative MicroTCA solution that is suitable for use in enterprise applications. It has been designed to be an economically viable solution with the smallest number of internal components possible for low-cost, high volume manufacture.
The Centellis 1000 platform provides highly integrated and verified hardware and software components, reduces development costs, and accelerates time-to-market.
The Centellis 1200 platform supports up to twelve single or double, compact, mid or full size AdvancedMC™ modules, making it an ideal platform for applications that require a mixture of single and double modules.