The Emerson Network Power AXP640 AdvancedTCA® shelf is specifically designed to address carrier-grade requirements desired by the telecommunications industry as well as high availability enterprise environments. Application examples include wireless infrastructure, packetized voice, wireline data, video distribution and cable network head-end devices. Highly integrated and verified hardware and software components, reduced development costs and accelerating time-to-market allow customers to focus their development resources on critical, differentiating features that provide a competitive advantage.
The heart of the AdvancedTCA (ATCA®) shelf is the 40G backplane. This allows for 40Gbps communication across the PICMG® 3.1 fabric interface. Using this technology, it is possible to upgrade to 40GbE capable switch and payload blades in the future without replacing the shelf infrastructure. ATCA 40G technology is becoming increasingly important as dataplane applications start migrating to ATCA based platforms.
Equally important are the thermal characteristics of the AXP640 shelf. It is designed to exceed the CP-TA B.4 and newly defined PICMG thermal profile, the highest level possible. This superior thermal performance is achieved with a front-to-back cooling architecture and therefore is ideal both traditional telecommunications and enterprise environments. Recent changes to GR-63 NEBS specification for telecom central office deployments have made front-to-rear cooling a mandatory feature for this type of equipment. Since six-slot systems from other ATCA suppliers typically have side-to-side cooling this has become an extremely important feature for smaller scale ATCA systems, and another example illustrating Emerson’s deep understanding of this market.
The power infrastructure of the AXP640 is designed to support AC and DC power inputs and provides up to 350 Watts/slot.
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