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Emerson Network Power > ASIA > Products > Racks and Integrated Cabinets > High Density Modular Cooling

High Density Modular Cooling

Intelligent cooling modules afford precise data center design, supporting an advanced thermal management infrastructure.

Refrigerant-Based
High heat density system can cool more than 30kW per rack. Offers floor-mount, rack-mount and ceiling-mount configurations. Utilizes pumped refrigerant, which is ideal for use around electronic equipment. Enhances the hot aisle/cold aisle approach to cooling.
High Density Cooling Enclosures - Direct Expansion
High capacity cooling enclosure. Provides a packaged solution to housing and cooling rack equipment. Offers total protection when combined with Liebert UPS and power strips. Offers an ideal solution for applications where hot aisle/cold aisle approach is not practical.
Rack Air Flow Enhancement
Easily installed rack fan unit. Enhances existing cooling solutions.
Heating, Ventilating, and Air Conditioning
Intelligent cooling modules are designed to connect to a computer center's thermal management infrastructure.